CSC/ECE 506 Spring 2012/12b sb: Difference between revisions
| Line 6: | Line 6: | ||
== Background == | == Background == | ||
' | On-chip interconnects are a natural extension of the high integration levels that nowadays are reached with multiprocessor integration. Moore's law predicted that the number of transistors in an integrated circuit doubles every two years. This assumption has driven the integration of on-chip components and continues to show the way in the semiconductor industry. | ||
[[File:Itr MIC image 920x460.png|thumb|c|right|Intel@ MIC]] | |||
In recent years, the main players in the chip industry keep racing to provide more cores integrated in a chip, with the multi-core (more than one core) and many-core (multi-core with so many cores that the historical multi-core techniques are not efficient any longer) technologies. This integration is known as [http://en.wikipedia.org/wiki/Multi-core_(computing) CMP] (chip multiprocessor) and lately Intel has coined the term [http://www.intel.com/content/www/us/en/architecture-and-technology/many-integrated-core/intel-many-integrated-core-architecture.html Intel@ Many Integrated Core (Intel@ MIC)]. | |||
To make feasible the communication in between these many cores inside of a single chip, the traditional off-chip network has proved to have limited applications. According to [[#References|[5]]], the off-chip designs suffered from I/O bottlenecks which are a diminished problem for on-chip technologies as the internal wiring provides much higher bandwidth and overcomes the delay associated with the external traffic. Nevertheless, the on-chip designs still have some challenges that need further study. Among some of these issues are power consumption and space constraints. | |||
== Topologies == | == Topologies == | ||
Revision as of 14:33, 8 April 2012
On-chip interconnects
Introduction
Background
On-chip interconnects are a natural extension of the high integration levels that nowadays are reached with multiprocessor integration. Moore's law predicted that the number of transistors in an integrated circuit doubles every two years. This assumption has driven the integration of on-chip components and continues to show the way in the semiconductor industry.
In recent years, the main players in the chip industry keep racing to provide more cores integrated in a chip, with the multi-core (more than one core) and many-core (multi-core with so many cores that the historical multi-core techniques are not efficient any longer) technologies. This integration is known as CMP (chip multiprocessor) and lately Intel has coined the term Intel@ Many Integrated Core (Intel@ MIC).
To make feasible the communication in between these many cores inside of a single chip, the traditional off-chip network has proved to have limited applications. According to [5], the off-chip designs suffered from I/O bottlenecks which are a diminished problem for on-chip technologies as the internal wiring provides much higher bandwidth and overcomes the delay associated with the external traffic. Nevertheless, the on-chip designs still have some challenges that need further study. Among some of these issues are power consumption and space constraints.
Topologies
Routing
Architectures
Ongoing research
References
[1] B. Grot and S. W. Keckler. Scalable on-chip interconnect topologies. 2nd Workshop on Chip Multiprocessor Memory Systems and Interconnects, 2008.
[2] Mirza-Aghatabar, M.; Koohi, S.; Hessabi, S.; Pedram, M.; , "An Empirical Investigation of Mesh and Torus NoC Topologies Under Different Routing Algorithms and Traffic Models," Digital System Design Architectures, Methods and Tools, 2007. DSD 2007. 10th Euromicro Conference on , vol., no., pp.19-26, 29-31 Aug. 2007
[3] Ying Ping Zhang; Taikyeong Jeong; Fei Chen; Haiping Wu; Nitzsche, R.; Gao, G.R.; , "A study of the on-chip interconnection network for the IBM Cyclops64 multi-core architecture," Parallel and Distributed Processing Symposium, 2006. IPDPS 2006. 20th International , vol., no., pp. 10 pp., 25-29 April 2006
[4] David Wentzlaff, Patrick Griffin, Henry Hoffmann, Liewei Bao, Bruce Edwards, Carl Ramey, Matthew Mattina, Chyi-Chang Miao, John F. Brown III, and Anant Agarwal. 2007. On-Chip Interconnection Architecture of the Tile Processor. IEEE Micro 27, 5 (September 2007), 15-31.
[5] Natalie Enright Jerger and Li-Shiuan Peh. On-Chip Networks. Synthesis Lectures on Computer Architecture. 2009, 141 pages. Morgan and Claypool Publishers.
[6] D. N. Jayasimha, B. Zafar, Y. Hoskote. On-chip interconnection networks: why they are different and how to compare them. Technical Report, Intel Corp, 2006